JPH0227506Y2 - - Google Patents
Info
- Publication number
- JPH0227506Y2 JPH0227506Y2 JP3183284U JP3183284U JPH0227506Y2 JP H0227506 Y2 JPH0227506 Y2 JP H0227506Y2 JP 3183284 U JP3183284 U JP 3183284U JP 3183284 U JP3183284 U JP 3183284U JP H0227506 Y2 JPH0227506 Y2 JP H0227506Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- plate
- flexible tape
- short conductive
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000002390 adhesive tape Substances 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3183284U JPS60145567U (ja) | 1984-03-06 | 1984-03-06 | ピン端子板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3183284U JPS60145567U (ja) | 1984-03-06 | 1984-03-06 | ピン端子板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60145567U JPS60145567U (ja) | 1985-09-27 |
| JPH0227506Y2 true JPH0227506Y2 (en]) | 1990-07-25 |
Family
ID=30532791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3183284U Granted JPS60145567U (ja) | 1984-03-06 | 1984-03-06 | ピン端子板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60145567U (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0785446B2 (ja) * | 1986-06-20 | 1995-09-13 | 株式会社三協精機製作所 | コイル部品 |
| JPS6346702A (ja) * | 1986-08-14 | 1988-02-27 | Sankyo Seiki Mfg Co Ltd | コイル部品 |
-
1984
- 1984-03-06 JP JP3183284U patent/JPS60145567U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60145567U (ja) | 1985-09-27 |
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